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Item |
Description |
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Layer |
Flex board: 1-16Layers |
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Flex-Rigid Board: 2-16Layers |
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Material |
PI, PET, PEN, FR-4 |
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Final Thickness |
Flex board: 0.002" - 0.1" (0.05-2.5mm) |
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Flex-rigid board: 0.0024" - 0.16" (0.06-4.0mm) |
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Surface Treatment |
Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin |
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Max / Min Board Size |
Min: 0.2"x0.3" Max: 20.5"x13" |
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Min Trace |
Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil |
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Width / Min Clearance |
1oz: 5/5mil 1oz: 5/5mil |
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2oz: 5/7mil 2oz: 5/7mil |
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Min Hole Ring |
Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil |
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1oz: 5mil 1oz: 5mil |
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2oz: 7mil 2oz: 7mil |
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Copper Thickness |
1/3oz - 2oz |
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Max / Min Insulation Thickness |
2mil/0.5mil (50um/12.7um) |
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Min Hole Size and Tolerance |
Min hole: 8mil |
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Tolerance: PTH±3mil, NPTH±2mil |
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Min Slot |
24mil x 35mil (0.6x0.9mm) |
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Solder Mask Alignment Tolerance |
±3mil |
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Silkscreen Alignment Tolerance |
±6mil |
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Silkscreen Line Width |
5mil |
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Gold Plating |
Nickel: 100u" - 200u" |
Gold: 1u"-4u" |
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Immersion Nickel / Gold |
Nickel: 100u" - 200u" |
Gold: 1u"-5u" |
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Immersion Silver |
Silver: 6u" - 12u" |
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OSP |
Film: 8u" - 20u" |
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Test Voltage |
Testing Fixture: 50-300V |
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Profile Tolerance of Punch |
Accurate mould:±2mil |
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Ordinary mould:±4mil |
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Knife mould:±8mil |
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Hand-Cut:±15mil |
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